Abstract
The lack of qualified packing systems above +250ºC is a major obstacle in fully realizing the potential of advanced high performance semiconductor materials in military and commercial systems. It is therefore necessary to produce a packaging material able to withstand higher operating temperatures and increased thermomechanical capability with the semiconductor substrate. In attempt to do this, a novel foam material produced via the synthesis of PBO (poly(p-phenylene- 2,6-benzobisoxazole)) was developed. Examination of the resulting foam demonstrates lightweight, non-flammable, non-toxic, shock resistant foam with thermal stability from -260ºC to +600ºC.
COinS